Total 31 Full-time staff nurse job vacancies in Malaysia

1. To setup complex test systems/ test SW solution with new feature for product line based on PAV provided by MFI team accordingly to the following requirement:
   • Lead the project tester concept study with CoC, SE and ENG
   • To plan and design overall tester as per concept defined
   • To plan project tester budget and procurement activity
   • To track project budget and ensure equipment cost within the planned budget
   • On time delivery of test systems to the production line according to project milestone (include manage of equipment, hardware interface and mechanical jig and fixture purchase)
   • Release the test system according to Test system Release Procedure
   • To train and coach maintenance plan, analysis tool of breakdown causes, Test system setup guideline and test fixture and job design concept)
   • To lead standardization activity in functional area
2. To manage procurement plan with involvement of central purchasing, PIR partner and supplier. Maintain supplier performance evaluation and ensure supplier’s deliver according to technical specification.
3. Responsible on full test implementation according to test procedure according to PAV defined by CoC team and achieve defined test coverage, make sure alignment and calibration process (such as flashing if memory, tuner alignment/ Calibration) is in line with test procedure.
4. To guide and coach engineer in technical issue.
5. General support on the following:
   • To lead and drive in TFOR/ FPY meeting to monitor daily operation test related issue.
   • To coordinate change management in process/ test approach
   • To analyze MIS data and coordinate improvement activities on test time reduction and machine
     effiency.
   • Early involved in new model concept discussion with CoC and TEF7, to ensure smooth handling from new project set up team after SOP
   • To setup new tool to increase setup efficiency
6. Any other TEF7 related duties assigned to.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Provide mechanical simulations and solutions for edge-cutting flash memory products.
• Develop inhouse structural simulation automation platform based on commercial softwares (e.g. ANSYS, Abaqus).
• Predict and define structural risks and mechanisms using simulation tools for electronic packaging design, assembly and reliabilities.
• Material characterization for simulation accuracy and efficiency improvement  

• You will work as SSD (Solid State Drive) package integration engineer in packaging engineering group.
• Leads new SSD product development from concept design and qualification to mass production.
• Generate innovative product concepts and transform them into tangible, market-ready products.
• Work closely with global functional teams in US, India, South Korea, and Israel, review feasibility design drawings and propose design options.
• Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFX (Design for eXellence) analysis, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), as well as Cost and UPH (unit per hour) analysis, review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality.
• Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time.
• Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions.
• Lead new product from low volume to high volume production transition with yield and quality meeting goals.
• Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
• Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production.

• Act as subject matter expert for the business with respect to labeling design, requirements, and implementation and labeling software and effectively collaborate on labeling changes.
• Ensure labeling compliance with quality management system (QMS), regulatory requirements and guidelines, standard operating procedures, and work instructions.
• Coordinate with cross functional team to develop strategies for continuous improvement of the labeling program and procedures (fool proof concept)
• Effectively manage labeling projects from ideation through completion.
• Improve from manual work flow to one piece flow concept to eliminate human error.

RESPONSIBILITIES:

• Design test plan, conduct validation testing on submitted drives, perform failure analysis, analyze test results (JMP), generate test reports, and provide engineering recommendation.
• Work independently or with cross functional teams to communicate schedules and assess readiness for volume production.
• Ensure products are validated in compliance with product specifications and customer performance requirements.
• Perform failure analysis or channel the failure to responsible groups for analysis where applicable.  
• Determine root cause and feedback to responsible groups to initiate corrective action. 
• Qualify new test and test system as required.
• Lead, coordinate and drives the team on closing critical issues, qualification, and projects.
• Actively looking for quality/efficiency improvement and test enhancement.
• Provide training to engineers / technicians.

• The Staff Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages. 
• Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements.  
• Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability.  
• Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions.  
• Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies.  
• Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes. Manages assembly yield improvement and package cost reduction programs.